DSM/ECU/TMP76xxx MH6xxx: Difference between revisions
| Line 95: | Line 95: | ||
* Possibly Tohoku Semiconductor/Sendai Fab | * Possibly Tohoku Semiconductor/Sendai Fab | ||
Though there is no evidence of this, only the coincidence of the plant's opening (~1987), Toshiba's involvement, mentions of microprocessor production and automotive specialization. | Though there is no evidence of this, only the coincidence of the plant's opening (~1987), Toshiba's involvement, mentions of microprocessor production and automotive specialization.<ref>https://www.chicagotribune.com/news/ct-xpm-1988-05-24-8801010911-story.html</ref> | ||
==Memory Map== | ==Memory Map== | ||
Revision as of 12:35, 3 March 2022
TMP76xxx/MH6xxx
MH6xxx are a microprocessor series produced for Mitsubishi Electric Corp. by Toshiba Corp.[1] by a yet to be determined division. They are used exclusively? for automotive applications in ECUs (PCBs and IC packaging marked Mitsubishi) for multiple makes in models including Mitsubishi's own Mitsubishi Motors Corp., Mitsubishi Motors North America Corp. (Diamond-Star Motors), as well as Mazda, Hyundai, Suzuki, and others.
Including
| Code | Meaning |
|---|---|
| ROM | |
| C | Masked ROM |
| P | One Time programmable (OTP) |
| E | EEPROM |
| Enhanced | |
| A | Enhanced |
| Packaging | |
| P | Plastic DIP |
| T | Plastic LCC (PLCC) |
| F | Plastic QFP |
| Toshiba | Mitsubishi | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Core | ROM | Sub-Type | Enhanced | Packaging | Line | Series | Type | Package | Note | |
| TMP | 76 | C | 40 | A | P | MH | 60 | ?? | 40-pin DIP | Never observed |
| P | 40 | A | P | 72 | OTP | |||||
| C | 75 | T | 61 | 11 | PLCC-68 | |||||
| P | 95 | T | 72 | OTP | ||||||
| C | 175 | A | T | 62 | 11 | PLCC-84 | ||||
| C | 1758 | F | 11F | QFP-100 | ||||||
| C | 55 | T | 63 | 11 | PLCC-100 | |||||
| C | 55 | A | F | 11F | QFP-100 | |||||
| E | 56 | A | F | 71F | QFP-100 | EEPROM | ||||
Simple cross-reference
76C40AP 76P40AP /MH6072 76C75T /MH6111 76P95T /MH6172 76C175AT/MH6211 76C1758F/MH6211F 76C55T /MH6311 76C55AF /MH6311F 76E56F /MH6371F
Production
Technology
- CMOS
From the microscope die images I compiled of TMP76C75T there can be seen in two corners of the die, test transistors. They are marked "S-G-N" and "S-G-P", Source-Gate-N-type and Source-Gate-P-type. From that, and production technology in use at the time based on their date codes (~1990-1995), these were produced with CMOS technology.
Process
- ~500-800nm
Based on production technology in use at the time, based on date codes ~90-95, sources point to the process as being ~500-800nm.[3][4][5]
Fab
- Possibly Tohoku Semiconductor/Sendai Fab
Though there is no evidence of this, only the coincidence of the plant's opening (~1987), Toshiba's involvement, mentions of microprocessor production and automotive specialization.[6]
Memory Map
Instruction Set
DSM/ECU/MH6211 Instruction Set[7]
DSM/ECU/TMP76xxx MH6xxx Instruction Set
IC/Die
Markings
IC/Packaging
Date Codes
- # = number
- X = letter
- ? = mix/unknown
- Y = Year digit
- M = Month letter
- W = Week digit
- R = Run code
YMWRRR #X#??? YYWWRRR ####???
FAQ
See Also
- https://siliconpr0n.org/archive/doku.php?id=mcmaster:toshiba:e556
- https://siliconpr0n.org/archive/doku.php?id=tag:vendor_toshiba&do=showtag&tag=vendor_toshiba
- ↑ * http://rhinopower.org/76xxx/76xxx.html
- ↑
- ↑ https://en.wikipedia.org/wiki/600_nm_process
- ↑ https://en.wikipedia.org/wiki/800_nm_process
- ↑ http://maltiel-consulting.com/Semiconductor_technology_memory.html
- ↑ https://www.chicagotribune.com/news/ct-xpm-1988-05-24-8801010911-story.html
- ↑
- ↑ https://janehacker1.gitbook.io/dsm-ecu/chips/prototype-76c75t
- ↑ https://janehacker.ca/wiki/index.php/MH6111_Microscopy
- ↑ * https://rhinopower.activeboard.com/t66419432/76c55-mh6311-information/?page=1#comment-67610185